(PhysOrg.com) -- It may soon be possible manufacture the miniscule structures that make up transistors and silicon chips rapidly and inexpensively. Swiss scientists are currently investigating the ...

The dense metallization required for backside power networks blocks traditional failure analysis techniques. As leading semiconductor companies prepare to deploy BPD in production, debug teams must ...

A new technical paper titled “APOSTLE: Asynchronously Parallel Optimization for Sizing Analog Transistors Using DNN Learning” was published by researchers at UT Austin and Analog Devices. Abstract ...

A new semiconductor inspection and metrology platform is set to begin validation in KIOXIA’s advanced production lines ...

(Nanowerk News) Smaller and faster has been the trend for electronic devices since the inception of the computer chip, but flat transistors have gotten about as small as physically possible. For ...

A team of scientists at Georgia Southern University has combined both spatial and temporal attention mechanisms to develop a new approach for PV inverter fault detection. Training the new method on a ...

University of Illinois researchers have developed a way to etch very tall, narrow finFETs, a type of transistor that forms a tall semiconductor 'fin' for the current to travel over.

A new method to fit together layers of semiconductors as thin as a few nanometers has resulted in not only a scientific discovery but also a new type of transistor for high-power electronic ...

If you’re looking for a testing method with higher peak current levels, a faster rise time, and more voltage spikes (than what’s offered by the human-body model), then IEC 61000-4-2 provides ...