Tessera Inc. Friday will unveil a new ultra-thin tri-fold stacked chip-scale package (CSP) co-developed with Intel Corp. for that firm's highest-density flash memory. Bruce McWilliams, president and ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which ...

Sunnyvale, Calif.-based Actel Corp. today released a new type of chip-scale package for its eX family of field programmable gate arrays (FPGAs) use in portable devices. According to Actel, the package ...

Achieving the circuit densities we need for the next generation of electronics demands advanced packaging and chip-scale interconnect solutions. The need to look for alternative packaging solutions to ...

Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces the processing ...

As cell phones and other devices get smaller but more powerful, chip packaging is taking on increased importance. And Tessera Technologies holds some important patents. Michael Kanellos is editor at ...

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Staccato Communications says its Ripcord wafer chip-scale package offers the smallest form factor of any Certified Wireless USB-based solution available, reducing the space needed to implement an ...