The following article was provided by Graham Teague, business development manager EMEA at TriQuint Semiconductor GmbH. In the highly competitive mobile handset business, manufacturers face continuous ...
NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...
Empower RF Systems has announced the release of its latest C-UAS RF amplifier module, Model 1211, engineered for robust ...
As part of the BEYOND5 project, CEA-Leti was responsible for developing a RF power module (FEM) combining three essential RF functions: a power amplifier (PA), which amplifies transmitted signals; a ...
With the exception of the iPhone, Apple's products largely lack technology to provide ubiquitous access to the outside world while on the go. However, a new proposal from the company would attempt to ...
TE Connectivity’s high-frequency nanominiature contact doubles density, reduces packaging. TE Connectivity, a connectivity and sensors company, has released new NanoRF modules and contacts, which ...
When paired with an LC-Series transmitter, these tiny SMT RF modules are said to provide a complete solution for the wireless transfer of serial, control and command information over distances in ...
New York, N.Y. — Persistent Systems, LLC (“Persistent”) announced today that it has released a Lower C-Band RF module for its MPU5 radio system, reflecting the company’s commitment to a truly modular ...
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