From quartz sand to silicon wafers, the manufacturing process is critical for achieving the purity and quality needed for advanced semiconductor applications.

SAN FRANCISCO–While the transistor may be on the minds of many a process R&D engineer these days, back-end-of-line (BEOL) interconnect technology and the materials challenges there– namely integrating ...

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...

The Soitec Group and the SEZ Group have initiated a joint development program (JDP) intended to speed the industrialisation of next-generation strained silicon-on-insulator (sSOI) substrates. Under ...

Jordan Valley, a leading supplier of X-ray based in-line metrology systems for advanced semiconductor manufacturers, today announced that it received an order from a market-leading equipment ...

Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during ...