Ansys Inc has announced the latest release of Ansys Icepak software, which applies fluid-dynamics technology to electronics thermal management. The 12.0 release introduces new features for PCB ...
Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
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