Increasingly, memory chips—in combinations of all their flavors, including DRAM, SRAM, and flash—are at the forefront of microelectronics end-product functions. This scenario is true for cell-phone ...
An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...
Demands for lower-cost, higher-density, and smaller-footprint ICs aimed at portable electronics make 3D-packaging designers sweat. The push for 3D packaging of semiconductor ICs directly results from ...
YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...
The 40nm gate-pitch cliff, 3D SoCs with microfluidic cooling, new fan-outs and 2.5D—it’s all on the table. An Steegen, executive vice president of semiconductor technology and systems at Imec, sat ...
Advanced packaging techniques are viewed as either a replacement for Moore’s Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can ...
Targeting a silicon device for a flip-chip package introduces significant IC and package design complexities throughout the entire product development cycle. This package-die combination must be ...
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