The SG25-BGA-2016 socket for a 2.76 x 2.76-mm, 0.35-mm-pitch wafer-level chip-scale package (WLCSP) operates at frequencies to 40 GHz with less than 1 dB of insertion loss (GSSG configuration).
Starting from 2018, the debates over wafer size have never stopped in the PV industry. Where M2 wafers used to be the standard, various PV players have proposed diversified wafer specifications since ...
China’s top wafer makers raised prices on key n-type formats, signaling potential module price rises toward CNY 1 ($0.14)/W in 2026 amid efforts to curb loss-making competition.
FREMONT, Calif., Nov. 09, 2020 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, will be showcasing its FOX-P™ ...
Edurne Zoco: Asian polysilicon inventory has reduced significantly and almost all Asian tier-1 manufacturers are sold out until April. All Asian producers are running at almost full capacity and ...
Two aspects need to be considered in the evolution of the size of PV silicon wafers: the influence of wafer size change on manufacturing costs in the industrial chain and the influence of wafer size ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVM9284 CameraCubeChip™ module—the world’s first ...
WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced its first shipment of the Company’s Dragonfly ® G3 system with the ...
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