With the continued need for shrinking pattern dimensions, semiconductor manufacturers continue to implement more complex patterning techniques, such as advanced multi-patterning, for the 10nm design ...
In anticipation of the SPIE Microlithography conference next week, KLA-Tencor Corp. today unveiled its Process Window Monitor (PWM) Series of critical dimension (CD) metrology systems designed for sub ...
SAN JOSE – KLA-Tencor Inc. has introduced a new product that identifies reticle design errors by inspecting the wafer in the IC production process. The product enbles chip makers to qualify the ...
With continuous device scaling, process windows have become narrower and narrower due to smaller feature sizes and greater process step variability [1]. A key task during the R&D stage of ...
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