Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...
Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...
CHANDLER, Ariz., Dec. 06, 2023 (GLOBE NEWSWIRE) -- The E-Mobility, sustainability and data center markets require products that are conducive to high-volume ...
SAN DIEGO--(BUSINESS WIRE)--Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, introduces press-fit RJ45 integrated connector modules (ICMs) with magnetics. Using ...
Adoption of silicon carbide (SiC) is becoming more widespread among electric-vehicle (EV) systems such as dc-dc converters, traction inverters, and on-board chargers (OBCs) with bidirectional ...
Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...
STMicroelectronics has introduced five silicon carbide (SiC) MOSFET-based high-power modules for electric vehicles (EV) that improve performance and driving range. The new SiC power modules cover a ...
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