Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Fan-out packaging on a large square panel is significantly more ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, ...

"Achieving breakthrough results in production at high volume is a significant milestone for Silicon Box, as well as for transitioning the industry towards more scalable and low-cost design and ...

Korean semiconductor packager Nepes has become the world's first to commercialize fan-out panel level package (FO-PLP) technology. It will allow smartphone makers to reduce costs spent on chips, which ...

TNO at Holst Centre works with a range of thin-film technologies, originally developed for display and electronics applications, that have very interesting potential in other, fast-growing application ...

Breakthrough yield and device performance at high volume show team can scale company's large-format advanced packaging for customers' cutting-edge applications SINGAPORE, Oct. 15, 2025 /PRNewswire/ -- ...