NEW DELHI: Sahasra Electronic, a homegrown manufacturer of electronics and printed circuit boards (PCB) is looking to raise Rs 186-crore through the initial public offer (IPO), for capital expenditure ...
SANTA CLARA, Calif. — ChipPAC Inc. today claimed to be the first semiconductor assembly house to be qualified for high-volume chip-scale packaging services in China. The U.S. company is now ramping ...
Breakthrough yield and device performance at high volume show team can scale company’s large-format advanced packaging for customers’ cutting-edge applications SINGAPORE, SG / ACCESS Newswire / ...
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