Rebecca Oesterle saw the packaging industry growth first hand as one of Energizer’s earliest supply chain managers. Over her career, she led many changes in packaging—an industry that would become ...
A new technical paper titled “A color-coded light-induced heating technology for Pb-free solder joints of advanced ...
Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...
Novel hybrid polymer “PET/F” expected to deliver enhanced performance compared with traditional PET plastic and have up to 100% bio content WEST SACRAMENTO, Calif. & BOLTON, Ontario--(BUSINESS ...
The MarketWatch News Department was not involved in the creation of this content. Enosemi Inc. ("Enosemi") and Jabil Inc. (NYSE: JBL) today announced a collaboration in advanced packaging process ...
The Shanghai World of Packaging (swop), co-organized by Messe Düsseldorf (Shanghai) Co., Ltd. and Adsale Exhibition Services Ltd., took place from November 25-27, 2025, at SNIEC (Shanghai New ...
NATICK, Mass. (May 24, 2016) -- When designing food processing and packaging for a future mission to Mars, researchers at the U.S. Army Natick Soldier Research, Development and Engineering Center, or ...
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ALPLA secures grant to pilot food-grade HDPE recycling
Austrian packaging and recycling company ALPLA has secured government funding in the Netherlands and set up a new recycling ...
A research team has developed a continuous roll-processing technology that transfers and packages flexible large-scale integrated circuits (LSI), the key element in constructing the computer's brain ...
People visit an international exhibition of food, packaging, processing technologies and HoReCa (hotel, restaurant and cafe) industry in Tashkent, the capital of Uzbekistan, on Oct. 4, 2025. The ...
SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...
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