When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries ...
The “dead time” during the vacuum and sealing process created a bottleneck that trickled down the entire production line. However, the transition to a Double Chamber Vacuum Packaging Machine ...
Advanced packaging has created new process bottlenecks related to the internal mechanics of the packaging equipment. As alignment tolerances compress from microns to tens of nanometers, motion ...
The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...
The focus has been on Intel Foundry's ability to compete on fab process nodes. But advanced packaging is the foundation on ...
Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing ...
As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
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