Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...

Built 70% smaller than its predecessor, the ROK104001 Bluetooth multi-chip module has been developed to speed time-to-market by enabling designers to quickly implement qualified and tested Bluetooth ...

Addressing the need for higher frequency and current in dc/dc converters, the TB7001FL multi-chip module combines a high side MOSFET, a MOSBD to handle low-side functions, and a driver IC that ...

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

When it comes to multi-chip module (MCM) manufacturing, fan-out wafer-level and fan-out panel-level packaging have received a lot of coverage recently. Every week, it seems like there is an ...

[Willem Melching] owns a 2010 Volkswagen Golf – a very common vehicle in Europe – and noticed that whilst the electronic steering rack supports the usual Lane Keep Assist (LKAS) system, and would be ...

Multi-chip module (MCM) graphics cards just might be the future, bringing upcoming generations of GPUs to a whole new level. Combining multiple dies instead of relying on a single chip could provide ...

First off, NVIDIA's next-gen Hopper GPU isn't a gaming architecture -- so we're not going to see the GeForce RTX 4080 Ti or something based on the Hopper GPU... but we have the most exciting GPU ...

Why it matters: Currently available deep learning resources are falling behind the curve due to increasing complexity, diverging resource requirements, and limitations imposed by existing hardware ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...