Diablo Technologies has brought flash right next to the microprocessor placing it on the DRAM channel and today’s microprocessors have multiple channels. The Diablo Technologies TerraDIMM puts ...

CXL, an advanced interconnect technology, facilitates high-bandwidth, low-latency connections between host processors and devices like accelerators and memory buffers. It addresses the "memory wall" ...

SE: As we struggle with AI/ML and power demands, what configurations need to be rethought? Will we see a shift away from Von Neumann architecture? Woo: In terms of system architectures, there’s a ...

Next-generation automotive systems are advancing beyond the limits of currently available technologies. The addition of advanced driver assistance systems (ADAS) and other advanced features requires ...

Chipmakers are beginning to incorporate multiple types and flavors of DRAM in the same advanced package, setting the stage for increasingly distributed memory but significantly more complex designs.

High bandwidth memory (HBM) chips have become a game changer in artificial intelligence (AI) applications by efficiently handling complex algorithms with high memory requirements. They became a major ...

Rambus makes revenue in three ways: memory interface chips, which protect and control the flow of data between the memory chip and CPU or GPU in a server; royalty revenue, in which Rambus licenses its ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

Apple is working with Samsung to change how RAM is packaged for the iPhone, with the aim of widening the bandwidth to help in AI tasks. While most smartphones have their RAM on the same package as the ...

Smart memory node device from UniFabriX is designed to accelerate memory performance and optimize data-center capacity for AI workloads. Israeli startup UniFabriX is aiming to give multi-core CPUs the ...