The six stacks of semiconductors for hybrid complementary metal-oxide semiconductor (CMOS) microchips advances miniaturization and topples the previous record of two stack King Abdullah University of ...

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow ...

Seoul National University’s College of Engineering announced that a research team led by Professor Chul-Ho Lee from the Department of Electrical and Computer Engineering has outlined a comprehensive ...