SK hynix HBM cooling takes a new form: the South Korean chipmaker embeds silicon-based elements directly inside the HBM ...

SK hynix has unveiled iHBM, a new thermal packaging architecture that embeds cooling elements, reducing thermal resistance by ...

Cadence (Nasdaq: CDNS) and Samsung Foundry today announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic AI digital, custom, 3D‑IC and ...

SK Hynix claims a 30% reduction in thermal resistance for its new chip design integrating cooling inside HBM memory stacks.

SkyeChip Berhad today announced that its HBM4/HBM3E combo PHY IP has been officially listed on Samsung Foundry CONNECT, Samsung Foundry's IP ecosystem platform. As the world's first combined ...

SK hynix has launched iHBM, an architecture featuring a Dynamic Random Access Memory (DRAM) ...

Through the iHBM solution, slated for deployment in next-generation HBM products including HBM5, SK hynix aims to increase ...

Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution including support for AP Memory's Xccela™ PSRAM and the latest LVpSRAM™ ...

A breakthrough in memory subsystem integration is redefining performance, flexibility, and time-to-market for advanced SoC designs. A fully silicon-proven DDR5/LPDDR5/DDR4 Combo PHY & Controller IP ...

PISCATAWAY, N.J.--(BUSINESS WIRE)--The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced a major update ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Continuing to lead the way forward for UFS technology, KIOXIA America, Inc. today announced sampling 1 of the industry’s first 2 Universal Flash Storage (UFS) 3 ...