Interesting Engineering on MSN

SK hynix builds innovative cooling solution inside a 3D stacked memory chip

SK hynix has launched iHBM, an architecture featuring a Dynamic Random Access Memory (DRAM) ...
Semiconductor Engineering

Energy-Efficient DRAM↔PIM Transfers for PIM Systems (KAIST)

A new technical paper titled “PIM-MMU: A Memory Management Unit for Accelerating Data Transfers in Commercial PIM Systems” was published by researchers at KAIST. “Processing-in-memory (PIM) has ...