CHUNAN, Taiwan--(BUSINESS WIRE)--TSLC Corporation, a vertically integrated LED system manufacturer, introduced the world’s first 0.49mm fine-pitch direct-lit display using 36 pixels-in-1 πLED package ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, has introduced new chip-on-board (COB) LED package lineups, including small LES ...
Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback