Researchers from Canada have unveiled a new germanium deposition process which is said to eliminate threading dislocations and be significantly cheaper than previous approaches. The scientists say ...
Photonic integrated circuit (PIC) has been the backbone for low-power and high-speed datacom/telecom communication systems, and is the enabling technology for a variety of emerging applications, ...
The first ever 6 inch InP wafers have been made by Japanese company Showa Denko. Courtesy of Compound Semiconductor magazine. Showa Denko (SDK) of Japan has developed the world's first 6 inch InP ...
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