Making Bluetooth-enabled audio smaller and more feature-rich, the IS2083BM IC and corresponding “superset” BM83 module incorporate functionality that enhances performance and provides flexibility. 1.
Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Nisshinbo Micro Devices Inc. has deployed multiple Cadence ® solutions, including the AI-based ...
Trigence Semiconductor has launched the first audio IC module (ICM) based on TDK’s semiconductor embedded substrate (SESUB) packaging technology. It’s an all-in-one audio output solution for ...
Mouser Electronics, Inc. is now stocking a new RFID module from Murata that is a small-sized HF band IC with embedded antenna. LXMS33HCNG-134 is the newest addition to the MAGICSTRAP series of RFID ...
To achieve this breakthrough, NTT applied its InP-based heterojunction bipolar transistor (InP HBT) technology1to improve the performance of amplifier ICs and package mounting technology to ...
Shrinking the "Blue Module," a host-controller-interface-level Bluetooth radio module, to 9.8 by 9.6 by 1.8 mm didn't spare integration and performance. In fact, both rose to even higher levels.
Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
In 2022, the overall revenue of the global IC design industry reached US$215.4 billion. Among them, the US IC design sector is the largest in scale, with a 63% market share and revenue of over US$130 ...
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