Rib parts (top) trialed using spring-frame molding (shown here, bottom, with curved C-channel part) and double diaphragm forming (DDF) processes in the DARPA-funded and Boeing co-funded RAPM program ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

As automotive engineers continue to search for ways to make lighter, less-costly components, the compression molding of composites has taken center stage in composites-for-metal substitution. Unlike ...

AZoM talks to DeWayne Howell and Jason Gabriel (Technical Engineering TenCate/CCS Composites), about the process of compression molding for composites and what the benefits and applications of this ...

In the automotive industry, especially in lightweight construction for hybrids and electric vehicles, there is growing demand for components that are not just light, but also exhibit high stiffness ...