Even with simulation, critical failure modes like resonance-induced fatigue and connection looseness can emerge during ...

Over the last decade, numerical simulation has become an indispensible tool for designing all kinds of engineered components. Here’s a short technical review of how to use finite-element analysis (FEA ...

In 2001, IBM patented a method of using a double bump material structure to make a reliable joint between a chip and its package for bump pitch below 150 µm. 1 This invention improved the existing ...

Professor of Mechanics, Washington University, St. Louis, Mo. It's easy to construct finite-element models with errors. And it's just as easy to correct them, when you know how. The first step in a ...