Understanding how dislocations (line defects in the crystal structure) occur when 3D-printing metals has been unclear to materials scientists. Understanding when and how dislocations form in ...
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...
(Nanowerk News) An international team of researchers, led by Professor Yu Zou (MSE), is using electric fields to control the motion of material defects. This work has important implications for ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
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