PHILADELPHIA--(BUSINESS WIRE)--Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today introduced its new IKONIC™ polishing pad platform, bringing to market Dow’s most ...
Cloud Management Platform empowers organizations to efficiently orchestrate, oversee, and optimize their cloud ecosystems across diverse environments. It facilitates intelligent automation, cost ...
AURORA, Ill., Oct. 20, 2010 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and growing ...
TOKYO--(BUSINESS WIRE)--Applied Materials, Inc. today raised CMP * technology to a new level while lowering system cost of ownership (CoO) with the launch of its Applied Reflexion ® GT system for ...
SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ -- Revasum today announced the availability of 200mm SiC wafer polishing capability on their 6EZ chemical mechanical polishing platform. The 6EZ has ...
Compound Growth at 16.49% Signals a New Phase of Cloud Management Platform Market Expansion MIDDLETON, Mass., April 14, 2025 /PRNewswire/ -- QKS Group, a premier market intelligence and advisory firm, ...
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