Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...
In this interview, Mark Bumiller, Technology Manager for Entegris talks to AZoM about using the Accusizer to detect large particles counts in CMP slurries. Please could you give us an introduction to ...
SAN JOSE — KLA-Tencor Corp. here rolled out what the company says is the industry's first production-worthy, in-situ film thickness and end-point control system for copper metal polishing in chemical ...
In semiconductor manufacturing, the chemical mechanical polishing (or CMP) step is used to planarize, or create a level topography, between each layer of the interconnect structure as the device is ...
Applied Materials Inc. will integrate single-wafer vapor drying technology from SCP Global Technologies into its Applied Reflexion LK CMP system, the company announced today. Applied has obtained a ...
Dow Unveils First CMP Polishing Pads from its IKONIC™ Platform; Brings New, Advanced Materials to th
PHILADELPHIA--(BUSINESS WIRE)-- Following the introduction of its IKONIC™ chemical mechanical planarization (CMP) polishing pad platform in late 2012, Dow Electronic Materials, a business unit of The ...
TAIPEI, Taiwan--(BUSINESS WIRE)--Dow Electronic Materials today introduced the OPTIVISION TM 4540 CMP Polishing Pad designed to deliver low defectivity and low cost of ownership (CoO) over pad ...
Dow Electronic Materials, a unit of U.S. chemical kingpin The Dow Chemical Company ( DOW), has launched the first chemical mechanical planarization (CMP) polishing pads from its new IKONIC 2000 and ...
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