It’s the tale of two promising and separate 3D chip architectures. One technology is slowly taking root, while the other one is heating up. 3D stacked-die using through-silicon vias (TSVs) is on the ...
The multiple demands of 3D NAND to enable yield and performance increase in difficulty at each generation. First generation devices, at 24-32 layer pairs, pushed process tools to extremes, going ...
SANTA CLARA, Calif., Feb. 28, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of ...
(Nanowerk News) Nanotechnology and nanoscience are enabled by nanofabrication. Electron-beam lithography (EBL), which makes patterns down to a few nanometers, is one of the fundamental pillars of ...
Fabrication of 3D NAND devices involves a challenging and complex deposition and etch process. Two etch processes have been identified as substantially impacting 3D NAND product yields: silicon ...
Soft lithography facilitates the fabrication of intricate three-dimensional patterns and structures at both microscale and nanoscale dimensions. Diverging from photolithography, a technique commonly ...
Nanotechnology and nanoscience are enabled by nanofabrication. Electron-beam lithography (EBL), which makes patterns down to a few nanometers, is one of the fundamental pillars of nanofabrication. In ...
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