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This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...
China is accelerating efforts in optical computer chips to overcome chip restrictions and lead the next wave of AI innovation ...
A new power supply technology for 3D-integrated chips has been developed using a vertically stacked architecture, where processing units are positioned directly above dynamic random access memory ...
As generative artificial-intelligence models become more sophisticated and eat up more energy to produce images and videos, the electronic chips that power them are reaching their limits of speed and ...
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